3D Circuit Design Engineer Job Vacancy Featured

Location: [mohali]
Type: Full-Time
Department: R&D/Engineering
Reports To: Chief Technology Officer

About Omnilink

Omnilink is at the forefront of innovation in electric circuits and web technology, delivering state-of-the-art solutions to our global clients. We are looking for a highly skilled 3D Circuit Design Engineer to join our cutting-edge team. This role is crucial in driving our commitment to technological advancement and excellence in 3D circuit design.

Job Requirements

1. Education and Experience:

• • Bachelor’s or Master’s degree in Electrical Engineering, Electronics, or a related field.
  • 3+ years of experience in 3D circuit design and semiconductor technology.

2. Technical Skills:

• • 3D Circuit Design: Proven experience in designing 3D integrated circuits, including through-silicon vias (TSVs) and interposer technologies.
  • CAD Software Proficiency: Advanced proficiency in CAD tools such as Cadence, Synopsys, or Mentor Graphics for 3D IC design.
  • Simulation and Modeling: Experience with simulation tools like ANSYS, COMSOL, or similar for thermal, electrical, and mechanical modeling of 3D circuits.
  • Layout Design: Expertise in layout design and verification using EDA tools.
  • PCB Design: Knowledge of PCB design and integration with 3D ICs.
  • Fabrication Processes: Understanding of semiconductor fabrication processes, including lithography, etching, and deposition techniques relevant to 3D ICs.

3. Soft Skills:

• • Problem-Solving: Strong analytical skills to troubleshoot complex design challenges and implement effective solutions.
  • Team Collaboration: Excellent communication skills for working with cross-disciplinary teams, including electrical engineers, software developers, and project managers.
  • Project Management: Ability to manage multiple projects, prioritize tasks, and meet deadlines effectively.
  • Detail-Oriented: High attention to detail to ensure precision in design and fabrication.

4. Desirable Skills:

• • 3D Packaging: Familiarity with advanced packaging technologies such as flip-chip, wafer-level packaging, and system-in-package (SiP).
  • Thermal Management: Knowledge of thermal management techniques for high-density 3D ICs.
  • Signal Integrity: Experience with signal integrity analysis and optimization for 3D interconnects.
  • Reliability Testing: Understanding of reliability testing methods for 3D circuits, including accelerated life testing and failure analysis.

5. Personal Attributes:

• • Innovative Mindset: Creative thinker who is eager to explore and implement new technologies and methods in 3D circuit design.
  • Quality Focused: Commitment to maintaining high standards in design, testing, and production.
  • Self-Motivated: Proactive with a strong sense of initiative and ownership of projects.
  • Adaptability: Ability to thrive in a fast-paced and ever-evolving technological landscape.

Responsibilities:

• • Design and Develop 3D Circuits: Create innovative 3D IC designs that meet performance, power, and area requirements.
  • Collaborate on Research Projects: Work with research teams to explore new 3D IC architectures and materials.
  • Prototype and Test: Develop prototypes and conduct rigorous testing to validate design performance.
  • Documentation: Maintain thorough documentation of design processes, simulations, and test results.
  • Industry Standards: Ensure all designs comply with relevant industry standards and best practices.
  • Continuous Learning: Stay updated with the latest advancements in 3D IC technology and incorporate new knowledge into design practices.

Benefits:

• • Competitive Salary: Commensurate with experience.
  • Health Benefits: Comprehensive health, dental, and vision insurance.
  • Professional Growth: Opportunities for continuous learning and career advancement.
  • Flexible Work Environment: Supportive policies for work-life balance and remote work options.